国际简称:Ieee Solid-state Circuits Letters 参考译名:IEEE 固态电路快报
主要研究方向:Engineering-Electrical and Electronic Engineering 非预警期刊
《IEEE 固态电路快报》(Ieee Solid-state Circuits Letters)是一本由IEEE出版的以Engineering-Electrical and Electronic Engineering为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。
IEEE Solid State Circuits Letters is an international academic journal dedicated to the field of solid-state circuits. This journal is published by the IEEE Solid State Circuit Society (SSCS) with the aim of rapidly disseminating the latest research findings in solid-state circuit design and technology. The journal covers a wide range of topics from basic research to application development, including but not limited to analog, digital, and mixed signal circuit design, integrated circuits, system on chips (SoCs), and related testing and manufacturing technologies.
The journal adopts a peer review process to ensure that the published research is of high quality and innovative. IEEE Solid State Circuits Letters is renowned for its fast publication cycle and high impact, providing an important platform for researchers and engineers worldwide to showcase their work. In addition, journals encourage the publication of Open Access articles to promote the widespread dissemination and application of scientific knowledge. It is not only an important resource for researchers in the field of solid-state circuits, but also a barometer for technological development and innovation in the industry.
| CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||
| 3.9 | 1.2 | 1.208 |
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名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
| Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
| 否 | 否 | 工程技术 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 |
| 按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
| 学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | ESCI | Q3 | 42 / 60 |
30.8 |
| 学科:ENGINEERING, ELECTRICAL & ELECTRONIC | ESCI | Q3 | 243 / 369 |
34.3 |
| 学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | ESCI | Q3 | 43 / 61 |
30.33 |
| 学科:ENGINEERING, ELECTRICAL & ELECTRONIC | ESCI | Q3 | 223 / 371 |
40.03 |
Author: Wu, Mu; Cheng, Yihang; Cui, Xingli; Pan, Sining; Wu, Huaqiang
Journal: IEEE SOLID-STATE CIRCUITS LETTERS. 2026; Vol. 9, Issue , pp. 109-112. DOI: 10.1109/LSSC.2026.3677301
Author: Nian, Cheng; Mo, Xiaorui; Zhang, Jiaqi; Farrukh, Fasih Ud Din; Peng, Jiaying; Chen, Fei; Zhang, Chun
Journal: IEEE SOLID-STATE CIRCUITS LETTERS. 2026; Vol. 9, Issue , pp. 113-116. DOI: 10.1109/LSSC.2026.3676726
Author: Cheng, Yihang; Zhang, Yihan; Wu, Huaqiang; Pan, Sining
Journal: IEEE SOLID-STATE CIRCUITS LETTERS. 2026; Vol. 9, Issue , pp. 93-96. DOI: 10.1109/LSSC.2026.3668876
Author: Wang, Bo; Tang, Yuchen; Liu, Feiran; Zhong, Xiaoxue; Ma, Yuchen; Si, Xin; Yang, Jun
Journal: IEEE SOLID-STATE CIRCUITS LETTERS. 2026; Vol. 9, Issue , pp. 97-100. DOI: 10.1109/LSSC.2026.3668853
Author: Lu, Di; Sun, Menghan; Zhu, Baoqi; Jiang, Xin; Yu, Ming
Journal: IEEE SOLID-STATE CIRCUITS LETTERS. 2026; Vol. 9, Issue , pp. 105-108. DOI: 10.1109/LSSC.2026.3668386
Author: Luo, Yanquan; Zhan, Mingtao; Zhong, Yi; Sun, Nan
Journal: IEEE SOLID-STATE CIRCUITS LETTERS. 2026; Vol. 9, Issue , pp. 61-64. DOI: 10.1109/LSSC.2026.3656180
Author: Li, Xiaofeng; Zhan, Yi; Zhu, Purui; Zhou, Rui; Song, Jiayin; You, Heng; Zhou, Yumei; Qiao, Shushan
Journal: IEEE SOLID-STATE CIRCUITS LETTERS. 2026; Vol. 9, Issue , pp. 45-48. DOI: 10.1109/LSSC.2026.3652570
Author: Chen, Zhonghao; Cheong, Ling-An; Yu, Tianyi; Chen, Yiming; Yin, Guodong; Yi, Teng; Liu, Yongpan; Yang, Huazhong; Li, Xueqing
Journal: IEEE SOLID-STATE CIRCUITS LETTERS. 2026; Vol. 9, Issue , pp. 73-76. DOI: 10.1109/LSSC.2026.3662477
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