国际简称:Inventions 参考译名:发明
主要研究方向:Engineering-Engineering (all) 非预警期刊 审稿周期:12 Weeks
《发明》(Inventions)是一本由Multidisciplinary Digital Publishing Institute (MDPI)出版的以Engineering-Engineering (all)为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。
Inventions magazine is an international publication focused on innovative technologies and inventions, aiming to provide a platform for inventors, engineers, scientists, and people passionate about new technologies around the world to share and exchange ideas. Since its establishment, this magazine has been dedicated to disseminating the latest technological information, providing in-depth coverage of groundbreaking inventions and creations, and exploring how these technological advancements affect our daily lives and social development. The content of the magazine covers a wide range of fields, including but not limited to mechanical engineering, electronic technology, biomedical science, materials science, information technology, artificial intelligence, etc. It also regularly publishes industry reports to help readers understand the latest developments and directions in different fields.
| CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||
| 5.7 | 0.463 | 0.976 |
|
名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
| Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
| 否 | 否 | 工程技术 | 4区 | ENGINEERING, MULTIDISCIPLINARY 工程:综合 | 4区 |
| 按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
| 学科:ENGINEERING, MULTIDISCIPLINARY | ESCI | Q2 | 69 / 178 |
61.5 |
| 学科:ENGINEERING, MULTIDISCIPLINARY | ESCI | Q2 | 64 / 179 |
64.53 |
Author: Huang, Yuxuan; Chen, Yuwei; Shao, Zhenguo; Chen, Feixiong; Shao, Yunting; Zhang, Yifan; Chen, Changming
Journal: INVENTIONS. 2026; Vol. 11, Issue 2, pp. -. DOI: 10.3390/inventions11020042
Author: Liu, Pei; Wen, Boge
Journal: INVENTIONS. 2026; Vol. 11, Issue 2, pp. -. DOI: 10.3390/inventions11020040
Author: Wang, Zhiliang; Li, Zhuo; Zeng, Keqiao; Wei, Wenfu; Yang, Zefeng; Zhang, Huan
Journal: INVENTIONS. 2026; Vol. 11, Issue 2, pp. -. DOI: 10.3390/inventions11020032
Author: Maitlo, Nizamuddin; Shah, Mahmood Hussain; Maitlo, Abdullah; Mustafa, Ghulam; Arshid, Kaleem; Noonari, Nooruddin
Journal: INVENTIONS. 2026; Vol. 11, Issue 2, pp. -. DOI: 10.3390/inventions11020031
Author: Ning, Xin; Yu, Rui; Liu, Longchen; Wang, Jiayi; Zou, Jingxin; Wang, Hao; Tan, Tian; Peng, Huajian; Yang, Xin
Journal: INVENTIONS. 2026; Vol. 11, Issue 2, pp. -. DOI: 10.3390/inventions11020028
Author: Yang, Caizhi; Zhang, Huan; Pan, Like; Yuan, Yuan; Yu, Qun; Xiong, Qing; Yang, Ziqian; Wei, Wenfu
Journal: INVENTIONS. 2026; Vol. 11, Issue 2, pp. -. DOI: 10.3390/inventions11020026
Author: Kang, Heran; Liu, Hongyang; Liu, Jianfei; Hao, Ruichen; Wang, Xiang; Hu, Wenbo; Chen, Jie; Yue, Wei; Li, Haibo; Lu, Zongxiang
Journal: INVENTIONS. 2026; Vol. 11, Issue 2, pp. -. DOI: 10.3390/inventions11020021
Author: Zhang, Jie; Guo, Longgang; Li, Lin; Qin, Jian; Zhang, Zhiqiang; Yang, Zefeng
Journal: INVENTIONS. 2026; Vol. 11, Issue 1, pp. -. DOI: 10.3390/inventions11010017
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