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首页 > SCI期刊 > 材料科学期刊 > International Journal Of Computational Materials Science And Engineering(非官网)

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同大类学科其它级别期刊：

中科院 1区期刊 JCR Q1 期刊中科院 2区期刊 JCR Q2 期刊中科院 3区期刊 JCR Q3 期刊中科院 4区期刊 JCR Q4 期刊

International Journal Of Computational Materials Science And Engineering

SCIE

国际简称：INT J COMPUT MAT SCI 参考译名：国际计算材料科学与工程杂志

主要研究方向：MATERIALS SCIENCE, MULTIDISCIPLINARY 非预警期刊

《国际计算材料科学与工程杂志》(International Journal Of Computational Materials Science And Engineering)是一本由World Scientific出版的以MATERIALS SCIENCE, MULTIDISCIPLINARY为研究特色的国际期刊，发表该领域相关的原创研究文章、评论文章和综述文章，及时报道该领域相关理论、实践和应用学科的最新发现，旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊，近三年没有被列入预警名单。

4区中科院分区
Q4 JCR分区
48 年发文量
1.5 IF影响因子
未开放 是否OA
4 issues/year 出版周期
English 出版语言

The International Journal of Computational Materials Science and Engineering is an international academic journal dedicated to computational methods and theories in the field of materials science and engineering. Since its inception, the magazine has been committed to providing a high-quality platform for publishing original research and review articles related to computational materials science, including but not limited to microstructure of materials, performance prediction, material design, and simulation of material processing and manufacturing processes.

This journal covers multiple aspects of materials science, including metals, ceramics, polymers, composite materials, nanomaterials, and biomaterials, with a particular emphasis on the application of computational methods in these fields, such as molecular dynamics simulations, quantum chemical calculations, multi-scale modeling, and the application of machine learning algorithms in materials science. The goal of the journal is to promote cutting-edge research in computational materials science, drive innovation in material design and development, and accelerate the transition from theory to practical applications. The editorial team of the magazine is composed of globally renowned scholars and experts, who ensure the academic rigor and innovation of the journal's content. The journal adopts a strict peer review system to ensure that the published research results meet international standards, while also encouraging interdisciplinary research and promoting cross disciplinary cooperation in fields such as materials science and engineering, physics, chemistry, mathematics, and computer science.

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International Journal Of Computational Materials Science And Engineering期刊信息

ISSN：2047-6841
出版语言：English
是否OA：未开放
E-ISSN：2047-685X
出版地区：SINGAPORE
是否预警：否
出版商：World Scientific
出版周期：4 issues/year
开源占比：0.0111
Gold OA文章占比：0.00%
OA被引用占比：0
出版国人文章占比：0.26
出版撤稿占比：
研究类文章占比：100.00%

International Journal Of Computational Materials Science And Engineering CiteScore评价数据（2026年6月最新版）

CiteScore

SJR

SNIP

CiteScore 指数

3.5

0.236

0.482

学科类别	分区	排名	百分位
大类：Mathematics 小类：Numerical Analysis	Q2	27 / 93	71%
大类：Mathematics 小类：Modeling and Simulation	Q2	148 / 397	62%
大类：Mathematics 小类：Computer Science Applications	Q2	491 / 1022	51%
大类：Mathematics 小类：Mechanics of Materials	Q2	202 / 408	50%
大类：Mathematics 小类：General Materials Science	Q3	272 / 475	42%

名词解释：CiteScore 是衡量期刊所发表文献的平均受引用次数，是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年（含计算年度）的被引次数除以该期刊近四年发表的文献数。例如，2022年的 CiteScore 计算方法为：2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量注：文献类型包括：文章、评论、会议论文、书籍章节和数据论文。

International Journal Of Computational Materials Science And Engineering中科院评价数据

《新锐期刊分区表》（2026年3月发布）

Top期刊	综述期刊	大类学科		小类学科
否	否	材料科学	4区	MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合	4区

International Journal Of Computational Materials Science And Engineering JCR评价数据

2025-2026年最新版

按JCI指标学科分区	收录子集	分区	排名	百分位
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY	ESCI	Q4	394 / 472	16.6
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY	ESCI	Q4	398 / 473	15.96

International Journal Of Computational Materials Science And Engineering历年数据统计

影响因子

中科院分区

International Journal Of Computational Materials Science And Engineering中国学者发文选摘

1、Biaxial strain-dependent electronic and optical behaviors of WSi2N4/g-GaN heterostructure: A first-principles stud
Author: Li, Jianwen; Deng, Tianhang; Wang, Xiang; Yuan, Lina; Li, Jie; Xu, Chengyong

Journal: INTERNATIONAL JOURNAL OF COMPUTATIONAL MATERIALS SCIENCE AND ENGINEERING. 2026; Vol. , Issue , pp. -. DOI: 10.1142/S204768412650003X
2、Effect of Winkler-Pasternak foundations and porosity on the electromechanical buckling responses of PZT-4/PZT-5H smart graded plate subjected to thermal loadin
Author: Kumar, Pawan; Sharma, Narayan; Su, Yipin; Harsha, S. P

Journal: INTERNATIONAL JOURNAL OF COMPUTATIONAL MATERIALS SCIENCE AND ENGINEERING. 2025; Vol. , Issue , pp. -. DOI: 10.1142/S2047684125500198
3、Study on the anti-penetration performance and perforation failure of Ti/Al3Ti/Al-laminated targe
Author: Miao, Yuzhong; Ding, Xuefeng; Shi, Yan; Yuan, Du; Zhang, Rui; Zhan, Yewang; Wang, Wenbo; Zhang, Shoubin

Journal: INTERNATIONAL JOURNAL OF COMPUTATIONAL MATERIALS SCIENCE AND ENGINEERING. 2025; Vol. , Issue , pp. -. DOI: 10.1142/S2047684125500137
4、Thermoelectric buckling response of nonuniform sigmoid functionally graded piezoelectric (SFGP) plate: Influence of elastic foundation and porosit
Author: Kumar, Pawan; Sharma, Narayan; Su, Yipin; Harsha, S. P

Journal: INTERNATIONAL JOURNAL OF COMPUTATIONAL MATERIALS SCIENCE AND ENGINEERING. 2025; Vol. , Issue , pp. -. DOI: 10.1142/S2047684125500149
5、Effect of subway speed and track irregularities on the fatigue life of e-type fastening clip under vehicle-track coupling dynamic
Author: Zhong, Shenghua; Liu, Yiping; Chen, Jinming; Tang, Liqun; Zhou, Licheng; Jiang, Zhenyu; Liu, Zejia; Yang, Bao

Journal: INTERNATIONAL JOURNAL OF COMPUTATIONAL MATERIALS SCIENCE AND ENGINEERING. 2025; Vol. , Issue , pp. -. DOI: 10.1142/S2047684125500095
6、Investigating effects of microstructural changes on microscopic strain field of high-pressure Die-Casting Al-Si alloys via RVE modelin
Author: Zheng, Zhen; Yang, Yu-tong; Huang, Shi-yao; Gong, Guo-bin; Zhang, Jin-sheng; Gong, Fu-jian; Wang, Zhi-bai; Han, Wei-jian; Zhang, Xue

Journal: INTERNATIONAL JOURNAL OF COMPUTATIONAL MATERIALS SCIENCE AND ENGINEERING. 2025; Vol. , Issue , pp. -. DOI: 10.1142/S2047684125500125