Journal Of Electronic Materials

SCI SCIE

国际简称：J ELECTRON MATER 参考译名：电子材料学报

主要研究方向：工程技术-材料科学：综合非预警期刊审稿周期：约3.0个月

《电子材料学报》(Journal Of Electronic Materials)是一本由Springer US出版的以工程技术-材料科学：综合为研究特色的国际期刊，发表该领域相关的原创研究文章、评论文章和综述文章，及时报道该领域相关理论、实践和应用学科的最新发现，旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊，近三年没有被列入预警名单。

4区中科院分区
Q2 JCR分区
934 年发文量
2.8 IF影响因子
未开放 是否OA
87 H-index
1972 创刊年份
Monthly 出版周期
English 出版语言

The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.

Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field.

A journal of The Minerals, Metals & Materials Society.

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Journal Of Electronic Materials期刊信息

ISSN：0361-5235
出版语言：English
是否OA：未开放
E-ISSN：1543-186X
出版地区：UNITED STATES
是否预警：否
出版商：Springer US
出版周期：Monthly
创刊时间：1972
开源占比：0.0292
Gold OA文章占比：5.20%
OA被引用占比：
出版国人文章占比：0
出版撤稿占比：
研究类文章占比：95.40%

Journal Of Electronic Materials CiteScore评价数据（2026年6月最新版）

CiteScore

SJR

SNIP

CiteScore 指数

4.6

0.471

0.682

学科类别	分区	排名	百分位
大类：Engineering 小类：Electrical and Electronic Engineering	Q2	348 / 1030	66%
大类：Engineering 小类：Condensed Matter Physics	Q2	177 / 446	60%
大类：Engineering 小类：Electronic, Optical and Magnetic Materials	Q2	136 / 318	57%
大类：Engineering 小类：Materials Chemistry	Q2	151 / 327	53%

名词解释：CiteScore 是衡量期刊所发表文献的平均受引用次数，是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年（含计算年度）的被引次数除以该期刊近四年发表的文献数。例如，2022年的 CiteScore 计算方法为：2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量注：文献类型包括：文章、评论、会议论文、书籍章节和数据论文。

Journal Of Electronic Materials中科院评价数据

《新锐期刊分区表》（2026年3月发布）

Top期刊	综述期刊	大类学科		小类学科
否	否	材料科学	4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 PHYSICS, APPLIED 物理：应用	4区 4区 4区

Journal Of Electronic Materials JCR评价数据

2025-2026年最新版

按JCI指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	180 / 369	51.4
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q3	298 / 472	37
学科：PHYSICS, APPLIED	SCIE	Q3	103 / 191	46.3
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q3	214 / 371	42.45
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q3	285 / 473	39.85
学科：PHYSICS, APPLIED	SCIE	Q3	112 / 191	41.62

Journal Of Electronic Materials历年数据统计

影响因子

中科院分区

Journal Of Electronic Materials中国学者发文选摘

1、Modeling for the Hybrid Schottky Junction: MXene/MAPbI
Author: Tseng, Ming-Lang; Ismail, Emad A. A.; Gorji, Nima E.; Awwad, Fuad A

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2026; Vol. 55, Issue 5, pp. 4713-4721. DOI: 10.1007/s11664-026-12763-8
2、Interfacial and Mechanical Properties of Sputtered Cu-Co UBM after Multiple Reflo
Author: Huang, Yinkai; Ma, Yong; Bao, Mingdong; Zhang, Yanjie

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2026; Vol. 55, Issue 4, pp. 3893-3901. DOI: 10.1007/s11664-026-12674-8
3、Evolution of CdX2 (X = Cl, I) Activation Treatment on Recrystallization and Physical Properties of CdTe Absorber Layers for Photovoltaic
Author: Kumari, Suman; Himanshu; Suthar, D.; Chasta, G.; Kumari, N.; Dhaka, M. S

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2026; Vol. , Issue , pp. -. DOI: 10.1007/s11664-026-12780-7
4、Nontoxic Gelcasting of Nano-SiO2-Doped CCTO Ceramics with Enhanced Dielectric Propertie
Author: Qin, Xueying; Jiang, Jia; Yin, Shuang; Zhang, Yeming; Wan, Wei

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2026; Vol. , Issue , pp. -. DOI: 10.1007/s11664-026-12829-7
5、Laser Cleaning for Mitigating Non-Wetting in CCGA Solder Joints While Preserving Joint Reliabilit
Author: Nan, Xujing; Mei, Zhipeng; Su, Chang; Yang, Zhaoying; Wang, Baocheng; Qiao, Liang

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2026; Vol. , Issue , pp. -. DOI: 10.1007/s11664-026-12820-2
6、Electrospun Y2Ti2O7 Nanotubes Suitable for High Charging Current Applications for Lithium-Ion Batterie
Author: Cong, Shanshan; Yu, Hongquan; Chen, Baojiu; Zhao, Hong; Zhang, Yong; Xu, Xiaoguang

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2026; Vol. , Issue , pp. -. DOI: 10.1007/s11664-026-12830-0
7、Simulation Optimization and Experimental Study on Laser Cleaning of TPT Adhesive from Solar Panel
Author: Yang, Qianqian; Zhang, Wei; Han, Ning; Li, Dongge

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2026; Vol. , Issue , pp. -. DOI: 10.1007/s11664-026-12842-w
8、Perovskite Solar Cells Based on a Methoxy Dual-Sided Modification Strateg
Author: Zhang, Lanhang; Yu, Shihao; Zhang, Nan; Wang, Lizhong; Dou, Kainan

Journal: JOURNAL OF ELECTRONIC MATERIALS. 2026; Vol. , Issue , pp. -. DOI: 10.1007/s11664-026-12851-9