Cmes-computer Modeling In Engineering & Sciences

SCI SCIE

国际简称：CMES-COMP MODEL ENG 参考译名：Cmes-工程与科学中的计算机建模

主要研究方向：ENGINEERING, MULTIDISCIPLINARY-MATHEMATICS, INTERDISCIPLINARY APPLICATIONS 非预警期刊审稿周期：约3.0个月

《Cmes-工程与科学中的计算机建模》(Cmes-computer Modeling In Engineering & Sciences)是一本由Tech Science Press出版的以ENGINEERING, MULTIDISCIPLINARY-MATHEMATICS, INTERDISCIPLINARY APPLICATIONS为研究特色的国际期刊，发表该领域相关的原创研究文章、评论文章和综述文章，及时报道该领域相关理论、实践和应用学科的最新发现，旨在促进该学科领域科学信息的快速交流。该期刊是一本开放期刊，近三年没有被列入预警名单。

3区中科院分区
Q1 JCR分区
528 年发文量
2.9 IF影响因子
开放是否OA
58 H-index
2000 创刊年份
Monthly 出版周期
English 出版语言

This journal publishes original research papers of reasonable permanent value, in the areas of computational mechanics, computational physics, computational chemistry, and computational biology, pertinent to solids, fluids, gases, biomaterials, and other continua. Various length scales (quantum, nano, micro, meso, and macro), and various time scales ( picoseconds to hours) are of interest. Papers which deal with multi-physics problems, as well as those which deal with the interfaces of mechanics, chemistry, and biology, are particularly encouraged. New computational approaches, and more efficient algorithms, which eventually make near-real-time computations possible, are welcome. Original papers dealing with new methods such as meshless methods, and mesh-reduction methods are sought.

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Cmes-computer Modeling In Engineering & Sciences期刊信息

ISSN：1526-1492
出版语言：English
是否OA：开放
E-ISSN：1526-1506
出版地区：UNITED STATES
是否预警：否
出版商：Tech Science Press
出版周期：Monthly
创刊时间：2000
开源占比：0.9899
Gold OA文章占比：98.28%
OA被引用占比：0.7382...
出版国人文章占比：0
出版撤稿占比：0
研究类文章占比：90.15%

Cmes-computer Modeling In Engineering & Sciences CiteScore评价数据（2026年6月最新版）

CiteScore

SJR

SNIP

CiteScore 指数

5.3

0.527

0.836

学科类别	分区	排名	百分位
大类：Mathematics 小类：Modeling and Simulation	Q1	78 / 397	80%
大类：Mathematics 小类：Computer Science Applications	Q2	352 / 1022	65%
大类：Mathematics 小类：Software	Q2	186 / 503	63%

名词解释：CiteScore 是衡量期刊所发表文献的平均受引用次数，是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年（含计算年度）的被引次数除以该期刊近四年发表的文献数。例如，2022年的 CiteScore 计算方法为：2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量注：文献类型包括：文章、评论、会议论文、书籍章节和数据论文。

Cmes-computer Modeling In Engineering & Sciences中科院评价数据

《新锐期刊分区表》（2026年3月发布）

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	3区	ENGINEERING, MULTIDISCIPLINARY 工程：综合 MATHEMATICS, INTERDISCIPLINARY APPLICATIONS 数学跨学科应用	3区 3区

Cmes-computer Modeling In Engineering & Sciences JCR评价数据

2025-2026年最新版

按JCI指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, MULTIDISCIPLINARY	SCIE	Q2	55 / 178	69.4
学科：MATHEMATICS, INTERDISCIPLINARY APPLICATIONS	SCIE	Q1	32 / 137	77
学科：ENGINEERING, MULTIDISCIPLINARY	SCIE	Q2	51 / 179	71.79
学科：MATHEMATICS, INTERDISCIPLINARY APPLICATIONS	SCIE	Q2	35 / 137	74.82

Cmes-computer Modeling In Engineering & Sciences历年数据统计

影响因子

中科院分区

Cmes-computer Modeling In Engineering & Sciences中国学者发文选摘

1、A Numerical Framework for Flexible-Electrical Coupled Analysis of Piezoelectric Structures with Large Deformation
Author: Sun, Xuan; Zhu, Yueying; Jin, Jiaxi; Li, Zhitong; Wang, Leizhi; Chen, Zhaobo

Journal: CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES. 2026; Vol. , Issue , pp. -. DOI: 10.32604/cmes.2026.078891
2、Numerical Investigation on Collapse Dynamics of Near-Wall Bubbles under Elliptical Surface Boundaries Condition
Author: Yu, Jun; Zhang, Lun-Ping; Zhang, Xian-Pi; Xie, Teng; Wu, Wei-Di; Zhu, Fang-Zhou

Journal: CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES. 2026; Vol. , Issue , pp. -. DOI: 10.32604/cmes.2026.078976
3、Bending Analysis of Functionally Graded Material and Cracked Homogeneous Thin Plates Using Meshfree Numerical Manifold Metho
Author: Huang, Shouyang; Zheng, Hong; Yu, Xuguang; Li, Ziheng; Pan, Zhiwei

Journal: CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES. 2026; Vol. 146, Issue 3, pp. -. DOI: 10.32604/cmes.2026.075929
4、DA-T3D: Distribution-Aware Cross-Modal Distillation Framework for Temporal 3D Object Detectio
Author: Jiao, Tianzhe; Chen, Yuming; Feng, Xiaoyue; Guo, Chaopeng; Song, Jie

Journal: CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES. 2026; Vol. , Issue , pp. -. DOI: 10.32604/cmes.2026.080595
5、An Isothermal Surface Imaging and Transfer Learning Framework for Fast Isothermal Surface Prediction and 3D Temperature Field Reconstruction in Metal Additive Manufacturin
Author: Wang, Zhidong; Lian, Yanping; Li, Mingjian; Chen, Jiawei; Gao, Ruxin

Journal: CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES. 2026; Vol. 146, Issue 3, pp. -. DOI: 10.32604/cmes.2026.078312
6、Robust Human Pose Estimation and Action Recognition Utilizing Feature Extractio
Author: Luo, Sheng; Abbasi, Rashid; Wang, Hao; Xu, Jinghua; Lyu, Dongyang; Zhang, Aaron; Amin, Farhan; de la Torre, Isabel; Mezquita, Gerardo Mendez; Gongora, Henry Fabian

Journal: CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES. 2026; Vol. 146, Issue 3, pp. -. DOI: 10.32604/cmes.2026.075080
7、Towards Real-Time Multi-Person Pose Estimation via Feature Selection and Sharpening Mechanism
Author: Dong, Chengang; Ding, Yongkang; Hu, Jianwei

Journal: CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES. 2026; Vol. 146, Issue 3, pp. -. DOI: 10.32604/cmes.2026.079062
8、Modeling and Optimization of Diffusion Process Scheduling under Strict Queue Time Constraints in Semiconductor Manufacturin
Author: Chen, Liangchao; Qiao, Yan; Zhang, Siwei; Liu, Bin; Shao, Yonghua; Zhan, Sijun

Journal: CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES. 2026; Vol. , Issue , pp. -. DOI: 10.32604/cmes.2026.076245